期刊文献+

Effect of Boundary Layers on Polycrystalline Silicon Chemical Vapor Deposition in a Trichlorosilane and Hydrogen System 被引量:4

Effect of Boundary Layers on Polycrystalline Silicon Chemical Vapor Deposition in a Trichlorosilane and Hydrogen System
下载PDF
导出
摘要 This paper presents the numerical investigation of the effects of momentum, thermal and species boundary layers on the characteristics of polycrystalline silicon deposition by comparing the deposition rates in three chemical vapor deposition (CVD) reactors. A two-dimensional model for the gas flow, heat transfer, and mass transfer was coupled to the gas-phase reaction and surface reaction mechanism for the deposition of polycrystalline silicon from trichlorosilane (TCS)-hydrogen system. The model was verified by comparing the simulated growth rate with the experimental and numerical data in the open literature. Computed results in the reactors indicate that the deposition characteristics are closely related to the momentum, thermal and mass boundary layer thickness. To yield higher deposition rate, there should be higher concentration of TCS gas on the substrate, and there should also be thinner boundary layer of HCl gas so that HCl gas could be pushed away from the surface of the substrate immediately. 这份报纸论述动量的效果的数字调查,热并且由在三化学蒸汽免职(CVD ) 比较免职率的多晶的硅免职的特征上的种类边界层反应堆。为煤气的流动,热转移,和集体转移的一个二维的模型从 trichlorosilane (TCS ) 为多晶的硅的免职被联合到煤气阶段的反应和表面反应机制氢系统。模型被在开的文学把模仿的生长率与试验性、数字的数据作比较验证。在反应堆的计算结果显示免职特征是仔细与动量有关,热、集体的边界层厚度。为了产出更高的免职,评价,应该有底层上的 TCS 气体的更高的集中,并且应该也有 HCl 气体的更薄的边界层以便 HCl 气体能立即从底层的表面被推开。
出处 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2011年第1期1-9,共9页 中国化学工程学报(英文版)
基金 Supported by the Natural Science Foundation of Shandong Province of China (ZR2009BM011) the Doctor Foundation of Shandong Province of China (BS2010NJ005)
关键词 boundary layer polycrystalline silicon numerical simulation mass diffusion 化学气相沉积法 边界层厚度 多晶硅 氢系统 三氯硅烷 氯化氢气体 沉积速率 数值模拟
  • 相关文献

参考文献2

二级参考文献42

  • 1赵洪力,蔡永秀,杨雪梅,刘广利,张福成.浮法玻璃在线镀复合膜的力学性能[J].硅酸盐学报,2006,34(8):917-921. 被引量:2
  • 2李国栋,张秀玲,胡仰栋.电子级多晶硅生产工艺的热力学分析[J].过程工程学报,2007,7(3):520-525. 被引量:25
  • 3[1]S.Matsumoto,Y.Sato,M.Kamo and N.Setaka:Jpn.J.Appl.Phys.,1982,21,L183.
  • 4[2]J.C.Angus and C.C.Hayman:Science,1988,241,913.
  • 5[3]W.A.Yarbrough and R.Messier:Science,1990,247,688.
  • 6[4]M.Uede and Y.Takagi:J.Mater.Res.,2001,16,3069.
  • 7[5]E.Kondoh,T.Ohta,T.Mitomo and K.Ohtsuka:J.Appl.Phys.,1992,72,705.
  • 8[6]G.H.Song,C.Sun,B.Wang,A.Y.Wang,R.F.Huang and L.S.Wen:Mater.Lett.,2001,48,8.
  • 9[7]C.Wolden,S.Mitra and K.K.Gleason:J.Appl.Phys.,1992,72,3750.
  • 10[8]G.H.Song,C.Sun,R.F.Huang,L.S.Wen and C.X.Shi:Surf.Coat.Technol.,2000,131,500.

共引文献21

同被引文献38

引证文献4

二级引证文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部