摘要
机载电子设备所处的工作环境非常恶劣,工作中电子设备中的功能模块经常要遭受诸如高低温、振动等不利因素的考验。文中通过介绍军用电子设备模块的生产过程,分析了振动试验过程中电子模块上元器件引脚产生断裂的原因,同时分析了模块冷板厚度对通孔元器件引脚应力影响,最后提出了解决措施以及在设计电子模块时模块冷板厚度选取应考虑的一些因素。
The surroundings of the airborne electronic equipment is very bad.The electronic modules in the equipment must undergo the bad environment,such as high-low temperature,vibration and so on.The manufacturing process of the electronic modules is introduced in this paper.The reason of the pin breakage during the vibration test in the electronic modules and the impact of the heatplate thickness for the pin stress is being analyzed.Finally the solutions and some factors which should be considerate during determining the heatplate thickness are also put forward.
出处
《电子机械工程》
2011年第1期15-18,共4页
Electro-Mechanical Engineering
关键词
元器件
引脚断裂
分析
component
pin breakage
analysis
