摘要
研究了复合无铅焊料Sn3.8Ag0.7Cu-xNi(x=0.5,1.0,2.0)与Au/Ni/Cu焊盘在不同回流次数下形成的焊点的性能。结果表明,Ni颗粒增强的复合焊料具有良好的润湿性能,熔点小于222℃;x为0.5的焊料界面IMC由针状(CuNi)6Sn5演化为双层IMC,即多面体状化合物(CuNi)6Sn5和回飞棒状(NiCu)3Sn4。当x超过1时,焊点界面只有单层回飞棒状(NiCu)3Sn4生成。并且,复合焊料焊点的剪切强度高于非复合焊料。
The composite lead-free solders Sn3.8Ag0.7Cu-xNi（x=0.5,1.0,2.0） were produced,the properties of the solders joints with Au/Ni/Cu pads were studied in different reflow numbers.Results show that the composites solders have optimal wetting ability compared with that of without Ni-adding.The melting point is less than 222 ℃.The intermetallic compounds（IMC） alters from the needle-like（CuNi）6Sn5 of the joint without Ni-adding to dual layers of polyhedron（CuNi）6Sn5 and boomerang shape（NiCu）3Sn4 when x=0.5,and only boomerang shape（NiCu）3Sn4 is formed at the interface between the composite solder and Ni layer when x exceeds 1.0.The shear strength of solder joints is higher than that without Ni-adding.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第6期53-57,共5页
Electronic Components And Materials
基金
浙江省2010年自然科学基金资助项目(No.Y4100809)
