期刊文献+

微水射流导引激光精密打孔过程的流动分析 被引量:12

Analysis of Fluid Flow in Micro-Waterjet Guided Laser Precision Drilling Process
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摘要 微水射流导引激光束精密加工是一项世界性的前沿技术,综合了激光加工和水射流切割的优点,具有相当优异的加工性能。本文从工程热物理和流体力学基础出发对此过程中的流动现象进行分析,研究微水射流导引激光束精密打孔的动力学过程,采用有限体积法(Finite Volume Method)建立了描述其间物理过程的数值模型。对打孔过程中熔池内部的流动和传热进行了模拟和分析,得到了不同时刻熔池内的温度和流场分布,计算结果显示:孔刚形成时孔的传播速率要大于停滞区界面的传播速率;随着孔的加深,停滞区界面停止向孔的内部传播。 Micro-waterjet guided laser processing is an internationally advanced technique based on guiding a laser beam inside a thin,high-speed waterjet.This process combines the advantages of laser processing with those of waterjet cutting.The study gives insight into dynamic process of micro-waterjet guided laser drilling process,analyzes the heat transfer and flow structure based on engineering thermophysics and flow dynamics theories.The physical and mathematical models were developed to present this drilling process using Finite Volume Method.The flow field and the temperature distribution in the melting pool and drilling cavity at different moments were calculated.The penetration speed of cavity is higher than the moving speed of stagnation zone interface at the beginning for cavity forming,and then the stagnation zone suspends to move with cavity deepening.
出处 《力学季刊》 CSCD 北大核心 2011年第2期159-165,共7页 Chinese Quarterly of Mechanics
基金 国家自然科学基金项目(11072091) 教育部留学回国人员科研启动基金([2008]890号) 教育部科学技术研究重点项目(210078) 江苏省重点实验室开放基金项目
关键词 水射流导引激光 打孔 流动 数值计算 waterjet guided laser drilling fluid flow numerical simulation
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参考文献8

  • 1Richerzhagen B. Water-guided laser processing[J]. Ind Laser Rev, 1997, 8- 10.
  • 2Laser-Microjet - a new method for material processing[R]. SYNOVA Report, Lausanne, Switzerland, 1998.
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二级参考文献6

  • 1Richerzhagen B. Water-Guided Laser Processing [J]. Industrial Laser Review Nov, 1997:8- 10.
  • 2SYNOVA Report. Laser-Microjet-A New Method for Material Processing [R]. Lausanne, Switzerland, 1998.
  • 3Li C F, Johnson D B, Kovacevic R. Modelling of Waterjet Guided Laser Grooving of Silicon [J]. Int. J. Machine Tools & Manufacture, 2003, 43:925-936.
  • 4WANG Y, L1 L, YANG L J, et al. Simulation and Experimental Research on Water-jet Guided Laser Cutting Silicon Wafer[C]//2008 International Conference on Electronic Packaging Technology &: High Density Packaging, Vol.sl and 2. USA: IEEE, 2008:826- 831.
  • 5Webb B W, Ma C F. Signal-Phase Liquid Jet Impingement Heat Transfer [J]. Adv. Heat Transfer, 1995, 26: 105-217.
  • 6Lehane C, Kwok H S. Enhanced Drilling Using a Dual-Pulse Nd:YAG Laser [J]. Appl. Phys. A: Materials Science & processing, 2001, (73): 45-48.

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