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低红外发射率耐高温涂层的制备及机理

Preparation of Heat Resistant Coatings with Low Infrared Emissivity and Mechanism
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摘要 以漂浮态铝粉为填料,有机硅树脂作为粘合剂,制备了耐高温低红外发射率涂层。对填料的添加量、涂层的固化温度进行了优化研究,对填料及涂层进行了结构、形貌的表征,并测试了涂层的红外发射率与耐热性能。研究结果表明,填料添加量为30%、400℃固化2h,涂层红外发射率(3~5μm,8~14μm)最低可达0.10~0.12,且涂层可在600℃条件下长时间使用。此外,分析认为涂层发射率的降低是消除粘合剂吸收及致密的片层连续结构两者协同作用的结果,并提出新的涂层结构模型对低发射率机理进行了阐述。 Low infrared emissivity coatings working at high temperature were obtained by using silicone resin and leafing aluminum as adhesives and paint, respectively. The effect of solidification temperature and the concentrations of leafing aluminum on emissivity was studied. The surface morphology and infrared emissivity of the as prepared coatings were investigated, and the heat resistant measurement was also performed. The results indicate that the infrared emissivity(3-5μm,8~14μm) of the coatings with 30% leafing aluminum can reach 0. 10-0. 12, and the coatings can work at 600℃ for a long time. It is thought that the reducing infrared absorption of adhesives as well as the formation of dense eontinuoust laminar aluminium structure may account for the lower emissivity of coatings, besides a new model of coating structure is proposed to illustrate the low emissivity mechanism.
出处 《材料导报》 EI CAS CSCD 北大核心 2011年第14期96-99,共4页 Materials Reports
基金 武器装备预研项目(51410040305HK0214) 国家自然科学基金重大研究计划(90505008) 973项目(xxxxx03zt2-06-ZZT2)
关键词 低发射率 耐高温 涂层结构 模型 low emissivity, heat resistant, coating structure, model
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