摘要
三维集成技术的发展是技术与理念的革新过程,本文根据集成封装技术的的发展历程,提出三维集成的发展特点,阐述理念的突破如何引导技术发展,以此为主线,可以更有逻辑性的了解三维集成的发展历史与趋势。封装从器件级向系统级的发展促使了多种系统级封装概念的出现;垂直堆叠方式推动互连长度不断降低;与晶圆级封装的结合可以大幅度降低成本;从同质向异质的转变则集成了多种学科、材料与技术,是实现复杂的系统的基础。
The development of 3D integration is a revolution process of technology and concept.Based on the historical evolution of integration and packaging,the characteristics of 3D integration are introduced in this paper,showing howthe breakthrough of concept enables the progress of technology.The development trend can be described as this：advanced system level packaging offers new integration schemes,vertical stacking decreases interconnection length,combined with wafer level packaging brings potential cost reduction,and heterogeneous integration offers a path for multifunction system with meterial,subject and technology integration.
出处
《中国集成电路》
2011年第7期23-28,共6页
China lntegrated Circuit
关键词
3D集成
系统封装
异质集成
3D integration
system packing
heterogeneous integration
