摘要
形变铜基原位复合材料具有超高的强度和良好的导电性,是高性能铜基材料发展的重要方向。综述了形变铜基原位复合材料的国内外研究现状,介绍了它的制备方法、组织演变、强化和导电机理,并对该类材料的研究方向进行了展望。
Deformation processed Cu-based in situ composites （ DPCC ）, which have ultra-high strength coupled with good conductivity, are one of the developing tendency of high-strength and high-conductivity Cu-based composites. Current research situation of DPCC is summarized in this paper. The preparation method, microstructure evolution, strengthening and electrical conduction mechanisms of DPCC are introduced. The developing tendency of the composites is finally presented.
出处
《热处理技术与装备》
2011年第4期45-49,共5页
Heat Treatment Technology and Equipment
基金
国家自然科学基金项目(50961006)
江西省铜钨新材料重点实验室开放基金项目(2010-WT-01)
关键词
高强高导
形变
铜
原位
复合材料
high-strength and high-conductivity
deformation process
copper, in situ
composite
