摘要
SnCu共晶钎料是公认的SnPb钎料最具潜力替代品,尤其在波峰焊上,但与其他无铅钎料相比,该钎料物理性能及铺展性能差,严重影响其广泛应用。本文通过在Sn0.7Cu合金基础上添加微量Ni来改善合金性能。结果表明:随Ni含量(w(Ni)<0.7%)增加,Sn0.7Cu钎料熔点逐渐增加,但变化不大,当w(Ni)0.7%时,钎料Sn0.7Cu0.7Ni的熔点较基体钎料提高了2.8℃;Ni含量对Sn0.7Cu合金导电性能会产生一定影响,随Ni含量增加,电阻率逐渐降低,当w(Ni)0.7%时,Sn0.7Cu0.7Ni合金电阻率较基体钎料降低16.7%;同时,在Sn0.7Cu添加微量Ni会明显改善钎料合金铺展性能,当w(Ni)0.1%时,Sn0.7Cu0.1Ni合金铺展面积最大,较基体钎料提高1倍,这主要与形成的新相Ni3Sn4及钎料与基板件金属间化合物状态有关。
SnCu eutectic solder was considered as the most potential succedaneum of SnPb solder,particularly in wave soldering,but the eutectic solder with poor physical properties and spreading properties limited its wide application compared to other lead-free solders.In the paper a new solder was made by adding trace Ni into Sn0.7Cu alloy to improve the performance.The results showed that the melting point of Sn0.7Cu solder increased with the increasing of the content of Ni(less than w(Ni)0.7%),but the effect was not obvious.And the melting point of Sn0.7Cu0.7Ni was 2.8 ℃ higher than that of the matrix solder.Ni had a certain effect on the conductivity of Sn0.7Cu alloy.The conductivities with different contents of Ni decrease with the increasing of the content of Ni(less than w(Ni)0.7%).When the content of Ni was 0.7%,the conductivity of Sn0.7Cu0.7Ni was 16.7% smaller than that of the matrix solder.At the same time,the spreading performance of the new solder alloy was improved obviously by adding trace Ni into Sn0.7Cu.When the content of Ni was 0.1%,the spreading area of Sn0.7Cu0.1Ni reached the maximum value and was about one times than that of the matrix solder,which was mainly related to the form of the new Ni3Sn4 phase and the thickness and shape of the metal intermetallic compound between the solder and the substrate.
出处
《焊接技术》
北大核心
2011年第8期40-43,80,共4页
Welding Technology
基金
河南高等学校青年骨干教师资助计划(20080352326)
洛阳市科技攻关项目(200801038A)
河南省高校科技创新人才支持计划(2010HASTIT032)
关键词
SnCu共晶钎料
熔点
电阻率
铺展面积
Sn0.7Cu eutectic solder,melting point,conductivity,spreading area
