摘要
三元层状化合物Ti3SiC2兼具陶瓷和金属的性能,受到材料研究者的广泛关注。该文采用热压工艺制备Ti3SiC2/Cu复合材料,研究Ti3SiC2含量及烧结温度对复合材料密度、抗弯强度、弹性模量、电阻率等性能的影响。结果表明,复合材料的相对密度对其性能有着重要的影响。当Ti3SiC2的质量分数在60%~80%范围内,其它参数保持不变时,降低Ti3SiC2的含量或者提高烧结温度,复合材料的相对密度增大,抗弯强度和弹性模量提高,电阻率下降。由于复合材料中陶瓷相占主要部分,因此复合材料的断裂方式为脆性断裂。其中烧结温度为980℃,保温时间为120 min的工艺下制备的60%Ti3SiC2/Cu复合材料具有最高的抗弯强度516 MPa;烧结温度1 200℃,保温时间30 min的工艺下制备的70%Ti3SiC2/Cu复合材料具有最低的电阻率0.155μΩ-m。
The ternary layered compound Ti3SiC2,which combines both the merits of metals and ceramics,has attracted extensive attentions.Ti3SiC2/Cu composites were prepared by hot pressing method in the present study.The effects of Ti3SiC2 content and sintering temperature on density,flexural strength,elastic modulus and electric resistivity of the composites were investigated.The results demonstrate that the relative density of composites has strong effect on the properties of composites.When the mass fraction of Ti3SiC2 is in a range of 60% ~ 80%,and other parameters remain unchanged,the density,flexural strength and Young＇s modulus increase and electric resistivity decreases with decreasing the mass fraction of Ti3SiC2 or increasing the sintering temperature.As the major proportion of the composites is ceramic phase,the fracture model of the composites is brittle fracture.The 60% Ti3SiC2/Cu sintered at 980 ℃ for 120min has the maximum flexural strength value of 516 MPa.The 70% Ti3SiC2/Cu sintered at 1 200 ℃ for 30 min has the lowest electric resistivity value of 0.155 μΩ·m.
出处
《粉末冶金材料科学与工程》
EI
2011年第4期587-590,共4页
Materials Science and Engineering of Powder Metallurgy
基金
国家自然科学基金资助项目(50672005)
