摘要
导电胶作为一种新型的绿色微电子封装互连材料,其应用范围越来越广,并且其代替传统的Pb-Sn焊料已成为必然趋势。介绍了导电胶的研究应用现状,总结了导电胶的优点及存在的问题。综述了近几年来在提高导电胶的电导率、接触电阻稳定性以及力学性能等方面的研究进展,并展望了导电胶未来的发展方向。
The conductive adhesive （ECA）,which was used as a new green microelectronic encapsulation interconnecting materials, had wider and wider application range, and the trend of traditional Pb-Sn solder replaced by ECA was inevitable. The ECA＇s actuality in research and applications was introduced,and the ECA＇s excellences and existent problems were summarized. The recent research progresses were also summarized in improving ECA＇s electrical conductivity, contact resistance stability, mechanical properties and other aspects. And the ECA＇s future development direction was expected.
出处
《中国胶粘剂》
CAS
北大核心
2011年第9期53-58,共6页
China Adhesives
关键词
导电胶
体积电阻率
接触电阻
力学性能
conductive adhesive （ECA）
volume resistivity
contact resistance
mechanical property
