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Design of 700 V triple RESURF nLDMOS with low on-resistance 被引量:1

Design of 700 V triple RESURF nLDMOS with low on-resistance
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摘要 A 700 V triple RESURF nLDMOS with a low specific on-resistance of 100 mΩ.cm^2 is designed. Compared with a conventional double RESURF nLDMOS whose P-type layer is located on the surface of the drift region, the P-type layer of a triple RESURF nLDMOS is located within it. The difference between the locations of the P-type layer means that a triple RESURF nLDMOS has about a 30% lower specific on-resistance at the same given breakdown voltage of 700 V. Detailed research of the influences of various parameters on breakdown voltage, specific on-resistance, as well as process tolerance is involved. The results may provide guiding principles for the design of triple RESURF nLDMOS. A 700 V triple RESURF nLDMOS with a low specific on-resistance of 100 mΩ.cm^2 is designed. Compared with a conventional double RESURF nLDMOS whose P-type layer is located on the surface of the drift region, the P-type layer of a triple RESURF nLDMOS is located within it. The difference between the locations of the P-type layer means that a triple RESURF nLDMOS has about a 30% lower specific on-resistance at the same given breakdown voltage of 700 V. Detailed research of the influences of various parameters on breakdown voltage, specific on-resistance, as well as process tolerance is involved. The results may provide guiding principles for the design of triple RESURF nLDMOS.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第11期47-50,共4页 半导体学报(英文版)
基金 supported by the National Natural Science Foundation of China(No.60906038) the Pre-Research Foundation,China(No. 9140A08010309DZ02) the Science-Technology Foundation for Young Scientist of University of Electronic Science and Technology of China(No.L08010301JX0830)
关键词 NLDMOS triple RESURF breakdown voltage specific on-resistance charge sharing nLDMOS triple RESURF breakdown voltage specific on-resistance charge sharing
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参考文献16

  • 1Ludikhuize A. A review of RESURF technology. International Symposium on Power Semiconductor Devices and IC's, 2000: 11.
  • 2Appels J, Vaes H, Verhoeven J, et al. High voltage thin layer de- vices (RESURF devices). International Electron Devices Meet- ing, 1979:238.
  • 3Ludikhuize A. Performance an innovation trends in RESURF technology. European Solid-State Device Research Conference, 2001:35.
  • 4He Jin, Zhang Xing. Analytical model of surface field distri- bution and breakdown voltage for RESURF LDMOS transistor. Chinese Journal of Semiconductors, 2001, 22(9): 1102.
  • 5Imam M, Quddus M, Adams J, et al. Efficacy of charge shar- ing in reshaping the surface electric field in high-voltage lateral RESURF devices. IEEE Trans Electron Devices, 2004, 51(1): 141.
  • 6Imam M, Hossain Z, Quddus M, et al. Design and optimization of double-RESURF high-voltage lateral devices for a manufac- turable process. IEEE Trans Electron Devices, 2003, 50(7): 1697.
  • 7Hossain Z. Determination of manufacturing RESURF process window for a robust 700 V double RESURF LDMOS transis- tor. International Symposium on Power Semiconductor Devices and IC's, 2008:133.
  • 8Li Q, Li Z J. A new analytical model for the surface electri- cal field distribution of double RESURF LDMOS. International Power Electronics and Motion Control Conference, 2006:1.
  • 9Qiao M, Li Z J, Zhang B, et al. Realization of over 650 V double RESURF LDMOS with HVI for high side gate drive IC. Interna- tional Conference on Solid-State and Circuit Technology, 2006: 248.
  • 10Wu J, Fang J, Zhang B, et al. A novel double RESURF LD- MOS with multiple rings in non-uniform drift region. Interna- tional Conference on Solid-State and Circuit Technology, 2004: 349.

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