摘要
在微机电系统(MEMS)中,影响多晶体微梁构件疲劳损伤的因素很多,如载荷方式、晶粒尺寸及其内部空间滑移系等。重点是从多晶铜微梁构件的微观结构入手,分析引起微构件疲劳损伤的内在应力机制。首先由两个取向分别为[110]和[100]的多晶铜晶粒构造一定厚度微梁模型,运用细观力学方法分析微梁在外载作用下,其内部晶粒的多个晶胞中主要晶体学滑移方向上的应力应变状态及其定量表达;在此基础上,确定多晶铜微梁构件内部晶粒晶体学取向角度对其晶胞内滑移系驱动分切应力的影响规律,并初步分析了多晶材料微梁内部晶粒的几何排布对微梁构件损伤力学行为的影响。
In micro-electromechanical systems（MEMS）,the fatigue damage of polycrystalline copper micro-beams has a lot of significant impact factors,such as the loading mode,grain size and interior space slip systems and so on.The most important point is to analyse the internal stress mechanism for the fatigue damage of micro-components based on the micro-structure of polycrystalline copper micro-beam components.Firstly,the micro-beam model with certain thickness was established by the polycrystalline copper grains of two spatial orientations,i.e. and .The stress and strain states and their numerical expressions of micro-beams in the mainly crystallographic slip directions in many cells of the internal grains were analysed with the external load by micro-mechanical methods.Finally,on the basis of the disscussion the impact law of the internal grain crystallographic orientation of polycrystalline copper micro-beam components on the driven shear stress of slip systems was determined,and the influence of the geome-tric arrangement of the internal grains for polycrystalline copper micro-beams on the damage mechanical behavior of micro-beam components was analyzed.
出处
《微纳电子技术》
CAS
北大核心
2011年第11期720-724,共5页
Micronanoelectronic Technology
基金
国家自然科学基金(10972056)
福建省自然科学基金(2008J0141
2009J01331)
关键词
微机电系统(MEMS)
疲劳损伤
晶胞
细观力学
微梁
micro-electromechanical system（MEMS）
fatigue damage
cell
micro-mechanics
micro-beam
