摘要
The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat source. Finite element method is applied to analyzed the temperature field in the solder ball, and experi- ment is conducted to test the vibration. the results show that,that, the temperature field flucturates with the same frequency as that of the laser pulse, which in turn causes a forced vibration of the same frequency in the liquid solder ball.
The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat source. Finite element method is applied to analyzed the temperature field in the solder ball, and experi- ment is conducted to test the vibration. the results show that,that, the temperature field flucturates with the same frequency as that of the laser pulse, which in turn causes a forced vibration of the same frequency in the liquid solder ball.
