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工作气压对磁控溅射Mo膜的影响 被引量:4

Effects of Work Pressure on Mo Films Deposited by DC Magnetron Sputtering
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摘要 采用直流磁控溅射沉积技术在不同工作气压下制备Mo膜,研究了工作气压对Mo膜的沉积速率、表面形貌及晶型结构的影响规律,研究表明:工作气压在0.1~0.5Pa范围内,沉积速率基本保持不变,在0.5~1.5Pa范围内沉积速率随工作气压的升高而增大;Mo膜的表面粗糙度随工作气压的升高而增加;不同工作气压下制备的Mo膜为立方结构,在较低工作气压下薄膜结晶性能较好。 Mo films were fabricated at different sputtering pressure by DC magnetron sputtering. Deposition rate, surface topography and crystal structure of Mo films as the function of work pressure were studied. The results show that, in the pressure range of 0.1 Pa-0.5 Pa, the deposition rate has little changes, while in the pressurerange of 0.5 Pa-1. 5 Pa, the deposition rate increases with increasing the sputtering pressure. The surface roughness of Mo films in crease with increasing the sputtering pressure. All the Mo films are cubic structure. At lower sputtering pressure, the crystal of Mo film becomes good.
出处 《表面技术》 EI CAS CSCD 北大核心 2011年第6期82-84,93,共4页 Surface Technology
基金 西华师范大学大学生科技创新基金项目(42710071)
关键词 直流磁控溅射 MO薄膜 工作气压 沉积速率 表面形貌 DC magnetron sputtering Mo films work pressure deposition rate surface topography
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