摘要
研究了高温下温度、组织、纯度对纯铜氧化的影响和铜表面氧化膜的附着性及其完整性。研究表明,温度对铜氧化速率的影响最大,其次是组织对氧化速率的影响,纯度对铜氧化速率的影响较小。铜(111)晶面氧化膜的附着性和完整性较好,(100)晶面较差,低纯铜(100)晶面氧化膜认为是机械钉扎作用附着性差且不完整;多晶铜表面氧化膜附着性和完整性比低纯和高纯单晶铜(100)晶面要好。
The impact, bftemperature, structure and purity on pure copper oxidation in high heat and the adhesion property and integrity of oxide films have been studied. The results have shown that temperature had more impact on oxidation rate of copper than the purity did. The impact of structure on the oxidation rate of copper was between the temperature and the purity. The adhesion property and integrity of oxide films on （111） crystal face were batter than the （100） crystal face. It was thought that the oxidation films of low pure copper on the （100） crystal face were mechanically nailed and Incomplete and the adhesion property was poor. The adhesion property and integrity of oxide films of the polycrystalline copper were better than the （100） crystal face of high and low pure single crystal copper.
出处
《中国铸造装备与技术》
CAS
2011年第6期11-13,共3页
China Foundry Machinery & Technology
关键词
纯铜
高温氧化
温度
组织
纯度
氧化膜
Pure copper
High heat oxidation
Temperature
Microtructure
Purity
Oxide films
