摘要
助焊剂能在焊料熔化前去除氧化膜、降低液态焊料表面张力,因此,在焊接过程中有着重要作用.气质联用(GC-MS)技术可以检测低沸点(300℃以下)的有机物质,本研究采用气质联用法对助焊剂中的主要活性成分进行分析.选用不同的溶剂对进口焊膏样品进行溶解,用离心分离的方法分离样品中的金属粉末和助焊剂,并用萃取分离的方法对助焊剂溶液中的复杂组分进行初分后,用GC-MS和红外光谱分析法对分离得到的样品进行分析测试,测出其所含组分的化学成分.该焊膏中的活性剂主要为松香酸、软脂酸、正辛酸和反油酸,溶剂为三丙二醇甲醚、二丙二醇、二丙二醇甲醚,缓蚀剂为苯并三氮唑.
The flux in solder can remove oxide film in the welding process work before solder melting, it also reduces the surface tension of liquid solder, so it plays an important role in the welding process. GC-MS technique can detect organic substances of boiling point less than 300℃. GC-MS technique was employed to analyze the main active ingredients of flux. Different solvents were used to dissolve import solder metal powder samples, and the flux was obtained by centrifugal separation. Both GC-MS and IR spectrometry were used to analyze the samples prepared by the extraction solution for the flux. The active agents in the solder were found to be abietic acid, palmitic acid, n-caprylic acid and elaidlc acid, and solvents including tripropylene glycol monomethyl ether, dipropylene glycol, dipropylence glycol monomethyl ehter, and 1,2,3-benzotriazole was used as the corrosion inhibitor.
出处
《湖南师范大学自然科学学报》
CAS
北大核心
2011年第6期53-57,共5页
Journal of Natural Science of Hunan Normal University
基金
长沙市科技攻关计划资助项目(K09050139-11)
