摘要
叠层片式ZnO压敏电阻器(MLCV)具有体积小、通流容量大、响应速度快、表面安装性好和易实现低压化等优点,其广泛应用于电子和电力系统中。介绍了叠层片式ZnO压敏电阻器的生片材料和内电极材料的研究现状,分析了当前工艺中存在的电极扩散问题,并提出了其解决的办法,同时指出了叠层片式ZnO压敏电阻器向低压化、小型化、集成化及低成本化方向发展的趋势。
Multilayer chip ZnO varistors （MLCV） are widely used in the fields ot electromc ana electric power system because of their small size, large .discharge current capacity, fast response, excellent surface mount and low voltage. The situations of research on raw materials and electrode materials of MLCV are introduced, the problems of electrode diffusion in the current manufacturing process are analyzed, and the solutions are also given. The development trends of MLCV that will focus on the low voltage, miniaturization, integration and low cost in the future are put forward.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2012年第2期64-67,共4页
Electronic Components And Materials
基金
广西科技厅广西科学研究与技术开发项目资助(No.桂科攻11107006-42)
