摘要
基板是裸芯片封装中热传导的关键环节。随着微电子技术的发展,组件热流密度越来越大,对新型基板材料的要求越来越高,要求具有高的热导率、低的热膨胀系数以及较低的密度。金刚石/铜复合材料作为新一代基板材料正得到愈来愈多的关注。文中分别通过实验和计算机仿真分析了金刚石/铜复合材料的镀覆性、焊接性以及作为基板材料的热性能。结果表明,金刚石/铜复合材料性能良好,可以作为裸芯片封装的基板材料。
The substrate for a bare die package is the primary thermal link between the junctions and the heat sink.With the rapid development of micro-electronics technique,the heat flux is getting higher and higher.As a result,there are more and more requirements for the new substrate material.The improved thermal management materials are required to have the performance of high thermal conductivities,low CTE and low density.As a new generation of substrate material,diamond /copper composites have attracted more and more attention.The galvanize ability,soldering ability and thermal characteristic of this kind of substrate material are researched by experiments and computer simulation respectively.It is found that diamond/copper composite material can be used as the ideal substrate material because of its good performance.
出处
《电子机械工程》
2011年第6期28-30,共3页
Electro-Mechanical Engineering
关键词
裸芯片
封装
金刚石/铜
热特性
bare die
packaging
diamond/copper
thermal characteristic
