摘要
分析了现代电子设备热流密度的特点,强调了热设计重要性,概括了热设计所涉及到内容,分别从导热、对流和热辐射三方面简要介绍了传热学的基本原理,根据传热学基本原理介绍了热设计方式的选择和几种常见的设计方式及特点。
This paper analyzes characteristics of heat flow density for modern electronic equipment,emphasizes the importance of design of heat flow density,and summarizes the contents involving to thermal design.The paper introduces briefly fundamental principle of thermal conducting from there points of view,that is heat conducting,heat exchange,and heat radiation.According to the basic principle of thermal conducting,how to select thermal design is introduced,and several thermal designs and their characteristics used commonly are described.
出处
《装备制造技术》
2012年第1期63-65,共3页
Equipment Manufacturing Technology
关键词
电子设备
热设计
传热学
结构设计
electronic equipments
thermal design
heat transfer
structure design
