摘要
介绍了功率器件装配过程中控制芯片烧结工艺参数的重要性,用显微红外热像仪测试了器件烧结工艺参数优化前后的微波瞬态热像,由热像测试数据计算出器件的热阻,并对器件的热阻值进行了比较,结果表明,通过烧结工艺参数优化,可以将器件热阻降低约20%。
This paper describes the importance rameters during assembly. Using infrared thermal controlling the chip soldering process paimaging system to capture the transient infrared images of the devices with and without process optimization, and calculating and comparing the thermal resistances, we find that the soldering process optimization brings us a 20% reduction of thermal resistance.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2012年第1期54-57,共4页
Research & Progress of SSE
关键词
瞬态红外热像
脉冲
结温
热阻
transient infrared thermal image
pulse
junction temperature
thermal resistance
