摘要
在以次磷酸钠为还原剂的化学镀铜体系中,考察了2,2'-联吡啶/亚铁氰化钾复合添加剂对化学镀铜的影响。采用电化学方法分析了无添加剂、单一添加剂和复合添加剂对次磷酸钠氧化电势和电流的影响,结果表明,2,2'-联吡啶、亚铁氰化钾和2,2'-联吡啶/亚铁氰化钾复合添加剂均使次磷酸钠氧化电势增加,氧化电流减小。扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)、四探针测试法(SZT-90)检测结果显示:较之单一添加剂,10 mg/L 2,2'-联吡啶/4 mg/L亚铁氰化钾复合添加剂所得铜镀层纯度更高〔w(Cu)=96.27%〕,外观更加光亮、致密和均匀,铜层表面平均电阻率也降低至0.022 9μΩ.m。
The electroless copper plating was studied in a bath consisting of sodium hypophosphite as reducing agent,2,2＇-dipyridyl and K4Fe（CN）6 as additives. The effect of various additives on the deposits was systematically investigated in this paper. The electrochemical analysis shows that the oxidation potential was increased with the addition of 2,2＇-dipyridyl and KaFe（ CN）6 additives ,while the oxidation current was decreased. Furthermore,the deposits were characterized by means of scanning electron microscope （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD） and four-probe method. Compared with single additive,the compound additive[10 mg/L 2,2＇-dipyridyl and 4 mg/L K4Fe（CN）6] brings about higher purity of deposit [ w （Cu） = 96. 27 % 3, and brighter and more compact deposit surface. In addition, the surface resistivity of the deposits was as low as 0.0229μΩ·m.
出处
《精细化工》
EI
CAS
CSCD
北大核心
2012年第3期294-298,共5页
Fine Chemicals
基金
国家高技术研究发展计划(863计划)(2008AAxxx310)
西南科技大学博士基金(08zx0101)
西南科技大学研究生创新基金(10ycjj07)~~
关键词
次磷酸钠
化学镀铜
复合添加剂
沉积速率
表面形貌
环氧树脂板
有机电化学与工业
sodium hypophosphite
electroless copper plating
compound additive
deposition rate
surface morphology
epoxy resin
electro-organic chemistry and industry
