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Moldflow在盒盖翘曲变形优化设计中的应用

Moldflow在盒盖翘曲变形优化设计中的应用
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摘要 本文以盒盖为例,借助模流分析软件Moldflow,对盒盖进行翘曲变形分析,得出产生翘曲变形主要是由取向不均和收缩不均引起的,通过对不同方案浇口位置和数量的比较,优化浇口位置,改善材料熔体的流动方向取向,调整保压曲线,有效地减少翘曲变形,达到了预期地变形目标值,为模具开发提供了依据。 In this paper,Exemplified by the box cover,by using Moldflow software,the warping deformation process of the box cover was simulated and analyzed.the main reason for warping deformation were analyzed.It indicated that the warping deformation was caused by uneven orientation and uneven shrinkage.Based on the comparative analysis of different project of gate location and gate quantity.By optimizing gate location,improving flow orientation of Materials melt,optimizing Packing Profiles,the best project was obtained.Which the amount of warping deformation was effectively reduced,met the design requirement,provided basis for mould development.
出处 《科技与企业》 2012年第6期280-281,共2页 Science-Technology Enterprise
关键词 MOLDFLOW 取向不均 浇口位置 保压曲线 翘曲变形 Moldflow uneven orientation gate location Packing Profile warpage
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