4NAKAZAWA K.Encapsulating compositon for LED:US,20060081864A1[P].2006-04-20.
5YOSHITAKE M,MURAKAMI M,MORITAY et al.Light emitting device encapuslated with silicones andcurabing silicone compositions for preparing the sili-cones:US,2010276721A1[P].2010-11-04.
6GRAIVER D,LOMAS A W.Preparation of polyorgansi-lioxanes by interfacial polymerization:US,5629401[P].1997-5-13.
7ZHA C,KUKULJ D.Process for producing polysilox-anes and use of the same:US,20040106761A1[P].2004-06-03.
8BOSTICK E E,FESSLER W A.Consensation methodfor making mutiple sequence organopolysiloxane blockpolymers:US,3578726[P].1971-05-11.
9OKAWA T.Method for preparing diphenylsiloxane/dimethylsiloxane copolymers:US,5169920[P].1992-12-08.
10OKAWA T,YAMADA S.Diphenylsiloxane-dimethyl-siloxane copolymer and method for the preparationthereof:US,5223596[P].1993-07-29.
6Fan Y R, Wang K. The viscosity of dimethyl silicone oiland the concentration of absorbed air[J]. American Institu-te of Chemical Engineers, 2011 , 57(12) : 3299-3304.
7Yang M H,Huang W J? Chen T C,et al. Synthesis andthermal properties of diphenylsiloxane block copolymers[J]. Polymer, 2001, 42(12); 8841-8846.
8CaminoG,Lomakin S M, Lazzari M. Polydimethylsiloxanethermal degradations Part 1. Kinetic aspects[J]. Polymer,2001, 42:2395-2402.
9Nakajima A,Miyahara H,Ishikawa T,et al. Streaming e-lectrification characteristics of silicone oil[J]. Transactionson Dielectrics and Electrical Insulation, 2008,15(2):519-526.
10Martin-Gil J,Martin-Gil F J, De Andres-Santos A I, et al.Thermal behaviour of medical grade silicone oils [J]. Jour-nal of Analytical and Applied Pyrolysis, 1997,42 : 151-158.
