摘要
介绍了在浮雕型全息图母版上化学喷银和化学镀镍制作金属导电层的方法，讨论了温度、次亚磷酸钠、醋酸钠和稀土元素对低温性条件下化学镀镍沉积速度的影响，并确定最佳配方及工艺条件。
The procees of Conductive metal Layer preparation by electroless plating of the relief hologram plate was introduced. The effects of temperature, sodium hypophosphite, sodium acetate and rare earth elements on the deposition rate of electroless plating under low temperature acidic conditions were discussed. The optimum formulation and technological parametars were described.
出处
《材料保护》
CAS
CSCD
北大核心
2000年第2期17-18,共2页
Materials Protection
