摘要
研究了以甲基四氢苯酐和间苯二胺作固化剂时 ,环氧树脂包封料的固化放热现象 ,测定了不同固化剂体系的包封料力学性能、电性能、密度和吸水性。结果表明 ,间苯二胺的活性大于酸酐固化剂的活性 ,但填料的加入使胺固化的放热降低 ,酸酐固化的升高。胺固化的冲击强度较高 ,加入填料可提高拉伸强度。胺固化的介电常数 ,介电损耗角较高 ,但体积电阻率较低 。
s [WT5BZ]With methy1 tetrahydrophthalic anhydride and m phenylenediamine as curing agent,the exothermal phenomena during the curing of epoxy encapsulant were studied,and the mechanical properties,electrical properties,density and water absorption of the encapsulants with different curing agents were determined.The results showed the activity of diamine was better than that of anhydride;the use of filler decreased the exotherm of diamine cure,but increased that of anhydride cure.The encapsulant cured by the diamine system had good impact strength,and the tensile strength was improved by the use of filler.The dielectric constant and dielectric loss angle tangent of the encapsulant cured by diamine system were high,but the volume resistivity was low,and the water absorption of the encapsulant was high. [WT5HZ]
出处
《塑料工业》
CAS
CSCD
北大核心
2000年第3期43-44,共2页
China Plastics Industry
基金
国家自然科学基金! ( 5 97770 15 )
