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环保型免清洗助焊剂组分对其腐蚀性能的影响及其机理 被引量:5

Effect of main components of environmental-friendly no-clean flux on its corrosivity and its mechanism
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摘要 主要研究活化剂、表面活性剂和缓蚀剂3种组分对环保型免清洗助焊剂腐蚀性能的影响。采用交流阻抗法研究了各组分对铜电极缓蚀性能的影响;通过扫描电镜观察测试了各组分对梳形试件的腐蚀;借助热分析研究了组分残留及相互作用。结果表明,随活化剂酸性的减弱,助焊剂体系的腐蚀性逐渐减弱;壬基酚聚氧乙烯醚系列的非离子表面活性剂有助于降低体系的腐蚀性能;缓蚀剂苯并三氮唑(BTA)的添加能显著改善助焊剂体系的缓蚀性能。用壬基酚聚氧乙烯(50)醚(w=0.2%)作表面活性剂、丁二酸和苹果酸复配(w=1.6%)作活化剂,BTA作缓蚀剂(w=0.06%)制备的助焊剂体系的膜电阻最大,在湿热条件下助焊剂对梳形试件的腐蚀明显降低,缓蚀性能最佳。热分析结果表明,体系缓蚀性能的改善可能是有机酸与丙三醇发生的酯化反应所致。 The influence of three main components of environmental-friendly no-clean flux(activator,surfactant and inhibitor)on its corrosivity was studied.The effect of different components on the copper electrode inhibition performance was studied by using alternating current(AC)impedance.The surface corrosion of three main components on comb patterns was also observed with scanning electron microscope,and the residue of flux and interaction were tested by thermal analysis.The results showed that the structure and acidity of the activator had some effect on the corrosivity of the flux.The weaker the acid,the weaker the corrosivity of the flux.The corrosion inhibition of the flux could be improved by the addition of polyoxyethylene nonyl phenyl ether as nonionic surfactant.With benzotriazole(BTA)as inhibitor,the corrosion inhibition performance of the flux was promoted effectively.The results showed that the no-clean flux,using polyoxyethylene nonyl phenyl ether(50)(w=0.2%)as surfactant,showed lower surface tension and better wetting properties.The mixture of succinate and malic acid(w=1.6%)as activator could help to increase the activity of flux.The welding plate expressed less corrosivity after soldering.The flux using BTA as corrosion inhibitor(w=0.06%) showed optimum corrosion inhibition performance,with high membrane resistance and lower inhibition on hydrothermal condition.The mechanisms of this action were discussed by thermal analysis,which showed that the esterification reaction between organic acid and glycerol may play an important role for corrosion inhibition performance improvement in the welding process.
出处 《化工学报》 EI CAS CSCD 北大核心 2012年第5期1504-1511,共8页 CIESC Journal
基金 广东省科技计划项目(2010B0108000029)~~
关键词 环保 免清洗助焊剂 无铅焊料 腐蚀性能 润湿力 environmental-friendly no-clean flux lead-free solder corrosivity wettability
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参考文献15

  • 1张怀武;何为;林金堵;胡文成 唐先忠.现代印制电路原理与工艺[M]北京:机械工业出版社,2009(1):182-185.
  • 2Alvin F S,David B J. Rosin-free,low VOC,no-clean soldering flux and method using the same[P].US,5571340,1996,(12).doi:10.1089/hum.2009.030.
  • 3Henderson W D,James S. Composition for increasing activity of a no-clean flux[P].US,6217671,2001,(1).doi:10.1097/MAJ.0b013e3181c14aaa.
  • 4Raj N M,Orion K S,Maria G,Mohammad Z K. No-clean flux for flip chip assembly[P].US,61035429,2000.doi:10.1038/nrneph.2009.210.
  • 5Girisb Wable,Quyen Chu,Purushothaman Damodaran,Krishnaswami Srihari. Wave soldering using Sn/3.0Ag/0 5Cu solder and water soluble VOC-free flux[J].IEEE Transactions on Electronics Packaging Manufacturing,2006,(03):203-220.
  • 6吴青青,郝志峰,余坚,李宇,刘文锋,张虎.水基免清洗型助焊剂研究进展[J].焊接技术,2011,40(1):3-8. 被引量:9
  • 7张冰冰.Study of VOC-free flux for lead-free solder[D]北京:北京工业大学,2008.
  • 8王世荣;李祥高;刘东志.表面活性剂化学[M]北京:中国轻工业出版社,2005203-206.
  • 9Gao Guilian,Baker Novi Jay D,Nation Brenda J,Tory Karen M. Water-based no-clean flux formulation[P].US,5443660,1995.
  • 10徐冬霞,王东斌,韩飞,雷永平.非离子表面活性剂对助焊剂润湿性能的影响[J].电子元件与材料,2010,29(9):33-36. 被引量:9

二级参考文献54

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同被引文献41

  • 1陈龙春,赵朝辉,王瑞杰,胡强.焊粉对锡膏稳定性的影响[J].稀有金属,2010,34(6):865-869. 被引量:8
  • 2李自托,董泉玉,杨从贵.国外有机类铜缓蚀剂综述[J].工业水处理,2005,25(1):18-20. 被引量:11
  • 3徐冬霞,雷永平,夏志东,史耀武.无VOCs水基免清洗助焊剂的研究[J].电子元件与材料,2005,24(12):26-28. 被引量:12
  • 4孙福星,庞正智,武德珍,沈建.HCl中咪唑衍生物复配对碳钢的缓蚀作用研究[J].北京化工大学学报(自然科学版),2005,32(6):99-102. 被引量:12
  • 5LEE N C. Reflow Soldering Process and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies [M]. Boston: Butterworth-Heinemann, 2001: 50-56.
  • 6HAO Z F, WU Q Q, SUN M, et al. Preparation of water-based no-clean flux for high temperature lead-free solder [J]. Advanced Materials Research, 2011, 314/316: 1112-1116.
  • 7ROCAK D, BUKAT K, ZUPAN M, et al. Comparison of new no-clean fluxes on PCBs and thick film hybrid circuits [J]. Microelectronics Journal, 1999, 30 (9): 887-893.
  • 8FERRARI M, RAVERA F. Surfactants and wetting at superhydrophobic surfaces: Water solutions and non aqueous liquids [J]. Advances in Colloid and Interface Science, 2010, 161 (1/2): 22-28.
  • 9SCHNEIDER A F, BLUMEL D B, BROUS J. Rosin-free, low VOC, no-clean soldering flux and method using the same: US, 5571340 [P]. 1996-11-05.
  • 10Andersson C, Liu J. Effect of corrosion on the low cycle fatiguebehavior of Sn-4.0Ag-0.5Cu lead-free solder joints[J]. InternationalJournal of Fatigue, 2008, 30(5): 917-930.

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