摘要
丝网印刷已成为微电子封装厚膜电路生产中的关键工艺技术。为满足微电子封装高精度、高密度的要求,从网版和印刷工艺参数两方面分析了影响高精细丝网印刷质量的因素。通过选用一定规格的不锈钢丝网,涂覆适当厚度的感光膜,开发出适合印刷50μm线宽和线间距的精密印刷网版;优化印刷工艺参数,将其中的刮刀压力、刮刀速度、离网间距分别控制在一定范围内,使印刷图形的变形量减少到200mm±30μm,实现线宽和间距为50μm、边缘清晰的精细印刷。
Fine screen printing has become the key technique of microelectronic packaging manufacture.In order to meet the needs of high precision and high consistency,effects of photosensitive emulsion thickness and meshes of silk screen, printing altitude,scraper velocity and pressure were researched in this paper. Stencil-plates using standard silk screen with stainless steel is developed which were covered with several micron thickness of photosensitive emulsion.By optimizing screen printing techniques such as printing altitude scraper pressure and velocity,fine screen printing of thick film integrated circuits are achieved.Both the line width and the space between lines were 50 μm while the deflecting precision was 200 mm ± 30 μm.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2012年第2期188-191,共4页
Research & Progress of SSE
关键词
精细印刷
丝网
微电子封装
厚膜电路
fine screen printing
silk screen
microelectronic packaging
thick film integrated circuits
