摘要
设计了一种利用半导体激光器InGaAs/I作为光源 ,采用钽酸锂热释电探测器作为光接收元件 ,以 80 31单片机为核心的中、高温物体比辐射率及温度的实时测量系统。该系统主要由光学发射与接收系统、信号放大与处理系统和显示系统三部分组成。文中还介绍了该系统的基本原理及结构 ,分析了其中的技术难点及其解决方法 ,讨论了系统的灵敏度、比辐射率与温度的测量精度。分析表明 :对 42 7℃的抛光钢铸件而言 ,系统的最小鉴别温差为 0 32K ,比辐射率的测量精度σελ=6 5× 10 -3 ,|σελ/ελ|=1 2 0 % ;温度的测量精度σT =1 0 6K ,|σT/T|=0 15 2 %。
This paper presents a new kind of the intelligent specific radiance and temperature measurement instrument using laser diode InGaAs/I as a light source and using pyroelectric detector and chip microprocessor in real time. This instrument consists of three parts: optical emitting and receiving system, signal amplifying and controlling system, and display system. The principle and structure of this instrument are introduced in detail in this paper. The key technologies and the corresponding solution methods are analyzed. Measurement precision of the specific radiance and the temperature are discussed. To polishing steel cast at 427℃, the results are NETD≤0 32K ,σ ε λ =6 5×10 -3 ,|σ ε λ /ε λ |=1 20%;σ T=1 06K ,|σ T /T|=0 152%.
出处
《光学技术》
CAS
CSCD
2000年第2期145-149,共5页
Optical Technique
关键词
比辐射率
辐射温度计
温度测量
半导体激光器
specific radiance
radiation thermometer
temperature measurement
real time measurement
laser diode
