摘要
采用二元熔盐氧化物Na2WO4和WO3,以脉冲电沉积的方法在占空比0.5、脉冲频率1000Hz、电沉积温度850°C的条件下,于热沉材料CuCrZr之上获得了金属钨镀层。讨论了电流密度对钨镀层微观结构、显微硬度、结合强度等性能的影响。当电流密度为20～30mA/cm2时,能够获得表面致密均匀的钨镀层。随着电流密度的增大,电流效率呈现先增大后下降的趋势,当电流密度为30mA/cm2时,电流效率达到最大值92.64%。
Metallic tungsten coatings were obtained by pulsed electrodeposition on Cu-Cr-Zr alloy, a heat sink material, from binary molten salt NazWO4-WO3 at 850 ~C with duty cycle 0.5 and frequency 1 000 Hz. The effect of current density on microstructure, microhardness, and bonding strength were discussed. Uniform and compact tungsten coatings were obtained when the current density varied from 20 mA/cm2 to 30 mA/cm2. The current efficiency was increased initially and then decreased with the increasing of current density, and reached the maximum value （92.64%） at 30 mA/cm2.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2012年第5期1-5,共5页
Electroplating & Finishing
基金
国际热核聚变实验堆(ITER)计划专项
聚变堆面向等离子体材料的基础研究(2010GB109000)
国家自然科学基金(50972008)
关键词
铜-铬-锆合金
钨
熔盐
电沉积
电流密度
微观结构
电流效率
copper-chromium-zirconium alloy
tungsten
molten salt
electrodeposition
current density
microstructure
current efficiency
