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不同固化体系环氧模塑料的性能研究 被引量:2

Properties of Epoxy Molding Compound with Different Curing Systems
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摘要 以邻甲酚醛环氧树脂(ECN)为基体,分别采用二氨基二苯砜(DDS)、双氰胺(DICY)、线型酚醛树脂(PF)为固化剂,以2-乙基4-甲基咪唑(2,4-EMI)为促进剂,制备了3种不同固化体系的环氧模塑料,研究了3种不同的固化体系对环氧模塑料工艺性能、力学性能、电绝缘性能、动态力学性能、贮存稳定性能的影响。结果表明:不同固化体系对环氧模塑料的工艺性能、动态力学性能和贮存稳定性能有较大影响,对环氧模塑料的冲击强度和电绝缘性能(表面电阻率和体积电阻率)影响不大。PF体系的玻璃化转变温度明显高于DDS体系和DICY体系的玻璃化转变温度。 Using o-cresol formaldehyde epoxy resin (ECN) as matrix, DDS, DICY and PF as curing agent and 2,4-EMI as curing accelerator, an epoxy molding compound (EMC) with three types of curing sys- tem was prepared. The effects of the three types of curing system on the processing property, mechanical properties, electrical resistance property, dynamic mechanical properties and storage stability of the EMC were studied. The results show that the three curing systems all have great effects on the processing property, dynamic mechanical properties and storage stability but have little influence on the impact strength and electrical resistance property (surface resistance and volume resistance). The glass transition temperature (Tg) of the PF curing system is obviously higher than that of DDS and DICY curing system.
出处 《绝缘材料》 CAS 北大核心 2012年第2期37-40,共4页 Insulating Materials
关键词 固化体系 环氧模塑料 动态力学性能 贮存稳定性能 curing system epoxy molding compound dynamic mechanical properties storage stability
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