摘要
基于固体与分子经验电子理论,以α-Cu基体强度为基础,利用相的最强键共用电子对数n_A和界面电子密度差△p,计算固溶、界面及析出强化强度增量,给出了铜合金抗拉强度计算模型。并以Cu-Cr-Sn-Zn合金为例进行计算,计算结果与测试强度符合,表明该计算模型正确且精度较高。
Based on the theory of empirical electron theory(EET) in solid and molecule,according to the strength of a-Cu matrix,the solid solution and precipitation strengthening increments were respectively calculated with the electron number n_A on the strongest bond in alloying phase and electron density difference △ρ on biphase interface.The tensile strength calculation model of copper alloy was proposed.According to the calculation model of CuCrSnZn alloy,the results are consistent with the experimental strength,which indicates the precision and accuracy of the calculation model.
出处
《河南科技大学学报（自然科学版）》
CAS
北大核心
2012年第4期1-5,共5页
Journal of Henan University of Science And Technology:Natural Science
基金
河南省科技攻关基金项目(102102210174)
河南科技大学重大科技前期预研专项(2008ZDYY005)
关键词
价电子结构
强度计算
铜合金
Valence electron structure
Strength calculation
Copper alloy
