摘要
目前,在高速PCB设计中,0.8mm间距BGA芯片的应用已非常普遍,但0.5mm间距BGA芯片的设计和焊接应用则相对较少。文章结合多层线路板的叠层规则、布线设计、信号回流以及钻孔工艺等技术,采用在0.5mm间距BGA芯片的焊盘上直接设计盘中通孔和一阶盲孔。在将PCB成本控制在规定预算范围内的同时,成功的将0.5mm间距BGA芯片应用在高密度互连PCB的研究与开发中。从生产出小批量单板的焊接情况看,系统上电后运行稳定,不存在短路和虚焊情况,从而较好的实现了电路工作性能,达到预先设计目标。
At this time, the 0.8mm pitch BGA chip applications is very common in high speed design of PCB, but the 0.5mm pitch BGA chip design and soldering is lack relatively. Combining the multi-layer circuit board laminating, wiring, signal returning and drilling technology, the article directly design plate hole and a blind hole in order in the 0.5mm pitch BGA chip pads. With the PCB cost is controlled within budgets, the research and development of 0.Smm pitch of BGA chip is successfully used in high density interconnect PCB. According to the production and soldering of a few of circuit board, the system is running stably and there is no short circuit and fault soldering. The circuit working performance and design target are achieved preferably.
出处
《印制电路信息》
2012年第3期32-33,44,共3页
Printed Circuit Information
