摘要
基于一体化封装基板,制备了大功率白光LED。以低热阻的一体化封装基板为基础,设计了结温测量系统。利用光谱仪测得不同结温下LED的光电参数,并对其机理进行了分析。在工作电流为0.34A,所研究温度范围为10.8～114.9℃。实验结果表明,一体化封装的LED结温与正向电压、光通量、光效和色温有着良好的线性关系;结温的变化对主波长及色坐标影响甚微;结温的上升导致蓝光段强度下降且光谱发生红移,黄光段强度上升且光谱发生宽化,峰值波长由450nm转为550nm。
The high-power white LED was prepared based on the integrated packaging. The j unction tem- perature of LEDs was measured based on the integrated packaging substrate with low thermal resistance. The photoelectric parameters under different junction temperatures were measured by spectrometer and the mechanism was researched . The applied current is 0.34 A and the temperature range is from 10.8℃ to 114. 9℃. The results show that the junction temperature has a good linear relationship with forward voltage,luminous flux, luminous efficiency and color temperature. The change of junction temperature has little effect on the dominant wavelength and color coordinate. The rise of junction temperature will lead to decreasing intensity and red shift for blue fight spectrum. Meanwhile, the intensity of yellow light is increased, the spectrum is widened, and the peak wavelength shifs from 450 nm to 550 nm.
出处
《光电子．激光》
EI
CAS
CSCD
北大核心
2012年第9期1691-1695,共5页
Journal of Optoelectronics·Laser
基金
国家自然科学基金(61076066)
陕西科技大学博士基金(BJ09-07)资助项目
关键词
LED
光谱
结温
光效
LED
spectrum
junction temperature
luminous efficiency
