摘要
以超细球形Al粉为模板,通过化学镀在其表面包覆镀Au,制备出Al/Au核壳结构的复合粉末,利用放电等离子烧结(SPS)技术使镀Au层与基体铝粉表层实现合金化,并制备出具有Al/Al-Au合金核壳结构的前驱体块材,随后采用两步法腐蚀除去核壳结构中的Al核并在其表层实现选择性地除去Al-Au合金层中Al的去合金化反应,得到多孔金块材。利用XRD、SEM、EDS研究了镀覆工艺对Al粉模板表面镀Au效果的影响及烧结、腐蚀过程中物相及化学成分的变化规律。结果表明,活化处理和还原剂种类对Al粉表面的镀覆效果有重要影响,制备的块体多孔金由纳米级孔径(80～120nm)和微米级孔径(1～10μm)两级孔径结构构成,微观组织结构均匀,密度低达0.39g/cm3,孔隙率为98%。
In this paper, aIuminium microspheres were used as templates, and the Al/Au compound mierospheres with core-shell structure were prepared by electroless gold plating. Then alloying happened between the gold player and the surface of the base aluminium powders during the spark plasma sintering （SPS） process. So block precursor with Al/Al-Au alloy core-shell structure was fabricated. Finally, block porous gold was got after the aluminium templates were etched with a two-step route, while the dealloying of the Al-Au alloy player happened in the same time. Emphasis was placed on optimizing the technical parameters of electroless gold plat- ing, so as well the variation of the phases and constituents in the process of sintering and corrosion. All of these process were characterized by XRD, SEM and EDS. It was found that the activation and reductant had great effects on the result of the eleetroless plating. The block porous gold prepared in this way had two-stage holes： nano holes（80-120nm） and micron holes（1-10μm）, which also had uniform microstructure with a density as low as 0.39g/cm3 and a porosity of 98%
出处
《功能材料》
EI
CAS
CSCD
北大核心
2012年第B08期141-144,共4页
Journal of Functional Materials
基金
博士点基金资助项目(20110181110002)
关键词
模板
去合金化
超低密度
多孔金
复合造孔
templates
deailoying
ultra-low-density
porous gold
composite pore-forming
