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耐高温交联侧基苯乙炔封端酰亚胺预聚体 被引量:2

Phenylethynyl-terminated Imide Oligomer of Having Pendent Phenylethynyl Group with Good Thermal Stability
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摘要 合成了含有苯乙炔基的二胺单体3,5-二氨基-4'-苯乙炔苯甲酮(DPEB),并与3,3',4,4'-联苯四酸二酐(s-BPDA)和1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ)进行了缩聚反应,以4-苯乙炔苯酐作为封端剂,合成了交联侧基苯乙炔封端酰亚胺预聚体(n=4).DSC测试结果表明,引入交联侧基后预聚体依然保持着较宽的加工窗口.利用所合成的预聚体在370℃热压1 h制备了热固性薄膜.DMA测试结果表明,引入交联侧基的预聚体树脂具有更高的玻璃化转变温度,并且其储存模量在玻璃化转变后有很好的保持. A diamine monomer 3,5-diamino-4'-phenylethynylbenzophenone (DPEB) was synthesized and phenylethynyl-terminated imide oligomers having pendent phenylethynyl group (rt = 4) was prepared by the reaction of 3,3', 4,4'-biphenylenetetracarboxylic dianhydride ( s-BPDA ), DPEB and 2,5-bis ( 4-aminophenoxy)-biphenyl(p-TPEQ), and end-capped with 4-phenylethynylphthalic anhydride (PEPA). The imide oli gomer had low Tg and pro, eided wide processing window. The cured films were prepared by molding the oligomer powder at 370 °C for 1 h under pressure. DMA results show tile introduction of pendent phenylethynyl group increases Ts of the cured film and the retention of storage modulus beyond Ts is promoted.
出处 《高等学校化学学报》 SCIE EI CAS CSCD 北大核心 2012年第9期2117-2120,共4页 Chemical Journal of Chinese Universities
基金 国家“九七三”计划项目(批准号:2010CB631100) 国家科技支撑计划项目(批准号:2011BAA06B03)资助
关键词 聚酰亚胺 预聚体 苯乙炔 交联侧基 3 5-二氨基-4'-苯乙炔苯甲酮 Polyimide Oligomer Cross-linked pendent group Phenylethyne 3,5-Diamino-4'-phenyl ethy-nylbenzophenone ( DPEB )
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