摘要
铜波导作为功率传输器件,其内腔镀银质量的优劣将直接影响其传输性能的高低,但按照传统的电镀工艺很难保证复杂铜波导内腔获得均匀的银镀层。从产品的结构设计、加工工艺等方面,分析了影响复杂铜波导内腔镀银质量的主要因素,并结合表面处理过程控制、添加辅助阳极、改进电镀工艺等方面,提出了提高复杂铜波导内腔镀银质量的方案。
As power transmission device, copper waveguide＇s transmission performance is directly affected by sil-ver electroplating quality in its cavity. If traditional electroplating process is used, it is difficulty to achieve uniform silver electrodeposit in the cavity of complicated copper waveguide. From the aspect of the product＇s structure design and ma- chining technics, the some key factors which have effects on electroplating quality of the cavity of complicated copper wavegui^te were analyzed. In addition, combining with some methods about process control of surface processing, appen-ding of assistant anode, improving of electroplating technics, the solution on improving electrodeposit quality of the waveguide＇s cavity was proposed.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2012年第5期105-107,共3页
Surface Technology
关键词
复杂铜波导
电镀
镀层质量
complicated copper waveguide
eiectroplating
electrodeposit quality
