期刊文献+

保温时间对Mg/Cu共晶反应钎焊连接的影响 被引量:4

Effects of Holding Time on Eutectic Contacting Reaction Brazing of Mg/Cu
原文传递
导出
摘要 采用共晶钎焊工艺对Mg/Cu异种材料进行连接,研究了不同保温时间对接头微观组织及力学性能的影响。结果表明,在焊接温度为500℃、保温时间为30 min、焊接压力为2 MPa的工艺下,焊接接头最高抗拉强度为54 MPa。 Magnesium alloy and copper were bonded by eutectic contacting reaction brazing, and the effects of holding time on the microstructure and tensile properties were studied. The results from the experiment show that when the welding process is 500 ℃ keeping for 30 rain, welding pressure is 2MPa, the tensile strength can reach 54MPa.
作者 王怀建 白莉
出处 《热加工工艺》 CSCD 北大核心 2012年第19期184-185,共2页 Hot Working Technology
关键词 共晶反应钎焊 压力 抗拉强度 微观组织 eutectic contacting reaction brazing pressure tensile strength microstructure
  • 相关文献

参考文献7

二级参考文献101

共引文献187

同被引文献26

  • 1刘红伟,周琦,朱军.镁合金焊接的研究现状及进展[J].兵器材料科学与工程,2005,28(3):68-71. 被引量:16
  • 2杨修荣.超薄板的CMT冷金属过渡技术[J].焊接,2005(12):52-54. 被引量:49
  • 3LEE W B, BANG K S? JUNG S B, et al. Effects of intermetalliccompound on the electrical and mechanical properties of frictionwelded Cu/Al bimetallic joints during anncaling[J], Journal of Al-loys and Compounds* 2011, 390(6) : 212-219.
  • 4MAHENDRAN G, BALASUBRAMANIAN V’SENTHILVELANT. Developing diffusion bonding windows for joining TiAl /40Cralloys[J], The International Journal of Advanced ManufacturingTechnology, 2009, 42(7-8):689-695.
  • 5宁礼奎.四种镍基高温合金的抗热腐蚀性能研究[D].辽宁大连:大连理工大学,2010.
  • 6元哲石,徐立新,吴执中.Ni+ Cu为中间层的TC4与ZQSnlO-lO的扩散连接试验分析[J].焊接学报,2012,46(3):56-63.
  • 7HIRANO T. Reliability of lead free solder joint by using chip sizepackage[J]. IEEE International Symposium on Electronics andthe Environment* 2012 , 31(5): 285-289.
  • 8宋敏霞,赵熹华,郭伟.Ti-6Al-4V/Ni/ZQSnl0-10的扩散连接[J].吉林大学学报(工学版),2012,36(7):67-73.
  • 9刘旭庆,周峰,梁永民.季膦盐离子液体对钢/锡青铜的摩擦磨损性能研究[J].摩擦学学报,2011,47(7):8卜87.
  • 10Yuan Xinjian, Sheng Guangmin, Luo Jun, et al. Microstructural characteristics of joint region during diffusion-brazing of magnesium alloy and stainless steel using pure copper interlayer [J]. Transaction of Nonferrous Metal Society of China, 2013, 23 (3) : 599-604.

引证文献4

二级引证文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部