摘要
以甲醛、苯酚为原料,草酸为催化剂,在不同条件下合成了系列热塑性电子封装级酚醛树脂材料。通过正交试验研究了原料物质的量比、反应温度、时间、催化剂用量等因素对树脂黏度、软化点、羟基值等参数的影响。正交试验的结果表明:反应温度为树脂黏度、羟基值的主要影响因素,而催化剂的量、原料物质的量比为树脂软化点的主、次要影响因素。
With using formaldehyde, phenol as raw materials and oxalic acid as catalyst, the different types of thermoplastic electronic packaging phenolic resin are synthesized under various conditions. The effects of reaction temperature, time, amount of catalyst, molar ratio of the raw materials, catalyst amount and other factors on the resin viscosity, softening point and hydroxyl value are studied by orthogonal test. The results of test show that the reaction temperature is the key influencing factor of the resin viscosity and the hydroxyl value. The amount of catalyst and the molar ratio of raw materials are the key and secondary influencing factors of the softening point respectively.
出处
《化学与粘合》
CAS
2012年第5期54-57,共4页
Chemistry and Adhesion
关键词
电子封装
酚醛树脂
合成工艺
正交试验
Electronic packaging
phenolic resin
synthesis technology
orthogonal experiment
