摘要
环氧导电胶是代替Sn/Pb焊料的一种胶黏剂,与传统的Sn/Pb焊料相比,环氧导电胶具有粘接温度低、可控性好、分辨率高、工艺简便以及环保等优点。近年来,科研工作者积极地研发高性能、多功能以及低成本的新型导电胶,以满足不断发展的市场需求。环氧导电胶作为一种新型的复合工业材料,具有巨大的发展潜力以及广阔的应用前景。阐述了影响环氧导电胶黏剂性能的因素以及高性能环氧导电胶的研究状况,并对环氧导电胶黏剂的未来发展作了展望。
The epoxy conductive adhesive is a substitute of Sn/Pb solder, compared to the traditional Sn/Pb solder, epoxy conductive adhesive has many advantages including low bonding temperature, good controllability, high resolution, simple technology and environmental friendly, etc. In recent years, the researchers have developed high-performance, multi-functional and low-cost novel conductive adhesive in order to meet the growing market demands. As a new industrial material, the epoxy conductive adhesive has great development potential and broad application prospects. The influenc- ing factors on epoxy conductive adhesive and study situation of high-performance epoxy conductive adhesive are presented, and its future development is prospect.
出处
《化学与粘合》
CAS
2012年第5期60-62,共3页
Chemistry and Adhesion
关键词
环氧导电胶黏剂
影响
性能
研究
Epoxy conductive adhesive
effect
performance
study
