摘要
为了在聚酰亚胺(PI)表面得到结合力良好的化学镀层,采用KOH溶液进行化学改性,在其表面制备金属钯微粒,然后进行化学镀铜。采用红外光谱仪(FTIR-ATR),显微电子探针(EDS)表征聚酰亚胺表面结构及表面元素,用X射线衍射(XRD),扫描电子显微镜(SEM)表征铜镀层性能。结果表明:聚酰亚胺表面在KOH溶液中发生水解,在氯化钯溶液中实现K+和Pd2+间的离子交换,形成吸附Pd2+;Pd2+被二甲氨基甲硼烷还原成钯原子,形成金属钯微粒;该钯微粒不仅能引发化学镀铜反应的发生,还能获得结合力良好的化学镀层。
The surface of polyimide(PI) was chemically modified by aqueous KOH.Then dimethyl amino borane was used to reduce aqueous PdCl2 generating Pd particulates on the modified surface of PI.Resultant PI with Pd particulates was finally coated with electroless Cu coating with improved adhesion to PI substrate.The chemical structure and elemental composition of PI surface were analyzed by means of Fourier transform infrared spectrometry and energy dispersive spectrometry,while the morphology and crystal structure of electroless Cu coating were analyzed by X-ray diffraction and scanning electron microscopy.Results indicate that the surface of PI is hydrolyzed in aqueous KOH allowing adsorption of Pd2+ by way of the ion-exchange between K+ and Pd2+ in aqueous PdCl2.The adsorbed Pd2+ ion is then reduced by dimethyl amino borane to form Pd particulates.Pd particulates formed in this way are able to initiate the reaction for electroless Cu plating and increase the adhesion of electroless Cu coating to PI substrate.
出处
《材料保护》
CAS
CSCD
北大核心
2012年第11期45-47,8-9,共3页
Materials Protection
基金
科技部国际合作项目(2009DFA62700)
关键词
化学镀铜
聚酰亚胺
表面改性
钯微粒制备
镀铜层形貌
结合力
electroless copper plating
polyimide
surface modification
preparation of palladium particulate
morphology of Cu coating
adhesion
