摘要
对CuCr50触头材料的优化热处理工艺进行了研究。结果表明 ,固溶后再时效处理的CuCr50的电导率、硬度高于只进行时效处理的试样 ,优化热处理工艺为 960℃固溶 30min后 530℃时效 3h ,硬度 12 8HB ,电导率为 19 0m·(Ω·mm2 ) - 1,此时Cu基体中过饱和的Cr以细小、点状质点大量均匀弥散析出 ,时效温度过高或过低 ,时间过长或过短 ,均不利于性能的提高 。
The heat treatment of CuCr50 contact materials has been studied in detail.The results show that the conductivity and the hardness of CuCr50 heat treated by solid solution and aging are greater than that of CuCr50 only treated by aging.The optimum heat treatment is solid solution at 960℃ for 30min,then aging at 530℃ for 3h.The Brinell hardness can reach 128, the conductivity reaches 19.0m·(Ω·mm 2) -1 , and the supersaturated are precipitated in form of very fine particles. The oxygen in the CuCr50 contact is as same as before the heat treatment.
基金
西北工业大学凝固技术国家重点实验室开放基金资助
