摘要
RapidIO是一种基于包交换的高速总线互连技术,支持芯片到芯片和板到板的通信,具有大带宽、高效率、低时延的特点,能满足嵌入式系统对高速数据交换的需求。介绍RapidIO的相关协议,设计以数字信号处理器(DSP)和现场可编程门阵列(FPGA)为节点的串行RapidIO互连系统,对互连系统的高速数据传输进行性能测试,DSP和FPGA的测试速度可分别达到586.6 MByte/s和888.9 MByte/s,并分析实测值与理论值存在差异的原因,为高速信号处理设备的设计研制提供技术支撑。
RapidIO is a kind of high speed bus interconnect technology based on packet switching with the characteristics of wide bandwidth,high efficiency and low delay,which supports the communication between chips and boards and meets the requirements of high data switching within embedded systems.This paper briefly introduces some relative protocols about RapidIO,designs a RapidIO switch system based on Digital Signal Processor（DSP） and Field Programmable Gate Array（FPGA）.The data switching rates are tested up to 586.6 MByte/s and 888.9 MByte/s for DSP and FPGA respectively.The difference between the measured value and theoretical value is analyzed,providing a technical support for the development of signal processing device with high speed.
出处
《信息与电子工程》
2012年第6期680-684,共5页
information and electronic engineering
