4STEIGERWALD D A, BHAT J C, COLLINS D, et al.Illumination with solid state lighting technology [ J ]. IEEE Journal of Selected Topics in Quantum Electronics, 2002,8(2) :310-320.
5MUTHU S, CHUURMANS F J P S, PASHLEY M D. Red, Green, and Blue LEDs for white light illumination [ J ]. IEEE Journal of Selected Topics in Quantum Electronics, 2002,8:333 - 338.
6PERALTA S, RUDA H. Applications for advanced solidstate lamps [ J ]. IEEE Industry Applications Magazine, 1998,4(4) :31-42.
7WU D, ONG V K S. Determination of material parameters from regions close to the collector using electron beam-induced current[J]. IEEE Trans. on Electron Devices. 20-23, 1996 : 111 - 114.
8RAGHUNATHAN R, BALIGA B J. EBIC investigation of edge termination techniques for silicon carbide power devices [ C ]. Power Semiconductor Devices and ICs, 1996. ISPSD'96 Proceedings, 8th International Symposium on, 1996:111-114.
9SEIGO I, HIDEO M. Failure analysis of wafer using backside OBIC method[J]. Microelectronics and Reliability, 1998,38 (6-8) :993-996.
10TAKESHITA T, SUGO M, SASAKI T, et al. Failure analysis of InGaAs/GaAs strained-Layer quantum-well lasers using a digital OBIC monitor [ J ]. IEEE Trans. Electron Devices, 2006,53 ( 2 ) : 211-217.
