摘要
采用化学镀工艺制备了镀铜SiC微粉。化学镀工艺参数对该复合粉体的包覆行为影响较大。利用冷压成型和无压烧结技术制备了SiCp/Cu基复合材料,并对该复合材料的微观结构和热膨胀系数进行研究。结果表明:SiC颗粒分布较均匀,SiC颗粒与基体之间界面结合良好;随测量温度增加,SiCp/Cu基复合材料的线膨胀系数呈非线性增加;当SiCp体积分数相同时,减小SiCp颗粒尺寸有利于降低复合材料的热膨胀系数。
The Cu-eoated SiC powder was fabricated by chemical plating technology. The parameters of chemical plating process have great influence on the cladding effect. The SiCp/Cu composites were fabricated by cold press molding and pressure-less sintering technique, and the microstructure and thermal expansion coefficient of the SiCp/Cu composites were investigated. The results show that SiC particles are more uniformly distributed in the SiCp/Cu composites, and the interfaces are well bonded. With the measuring temperature increasing, the linear expansion coefficients of SiCp/Cu composites are nonlinearly increasing. When SiCp volume fraction is constant, the thermal expansion coefficients of SiCp/Cu composites will reduce as the size of SiC particle becomes finer.
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2013年第1期118-121,共4页
Ordnance Material Science and Engineering
基金
黑龙江省教育厅科学技术研究项目(12521521)
省教育厅研究生创新科研项目(YJSCX2012-365HLJ)
佳木斯大学科研项目(L2012-009)
关键词
电子封装材料
化学镀
SICP
CU基复合材料
热膨胀系数
electronic packaging materials
electroless plating
SiCJCu composites
coefficient of thermal expansion
