摘要
采用双臂电桥法测量了不同氧化程度的裸铜框架的电阻，在此基础上分析了烘箱内氧浓度、烘烤温度和框架表面镀铜厚度对框架氧化程度的影响。研究发现，在氧浓度≤0．1％的氮气保护环境中，经过180℃烘烤60min后，裸铜框架的氧化程度大于无氮气保护下100℃烘烤60min后的氧化程度；镀铜层能有效提高裸铜框架在100-180℃范围内的抗氧化能力，镀铜层较厚（1．0岬）的裸铜框架的抗氧化能力优于镀铜层较薄（0．5岬）的裸铜框架的抗氧化能力。
In this paper, using double bridge method, the resistances of bare-copper leadframes with different degrees of oxidation were measured. Based on these measurements, effects of oxygen concentration, baking temperature and thickness of copper coating on oxidation of bare-copper leadframe were studied. This study results show that the oxidation of bare-copper leadframe were baked at the temperature of 180 ℃ for 60 min under oxygen concentration of 0.1% within Nitrogen environment is more serious than which was caused by baking at the temperature of 100℃ for 60 min under atmosphere. Moreover, copper coating can effectively improve the oxidation resistance of bare-copper leadframe at the range of 100-180 ℃, and the oxidation resistance of bare-copper leadframe with 1.0 μm copper coating is superior to that of another bare-copper leadframe with 0.5μm copper coating.
出处
《电子与封装》
2013年第1期9-11,16,共4页
Electronics & Packaging
关键词
裸铜框架
双臂电桥
电阻
镀铜厚度
bare-copper leadframe
double bridge
resistances
thickness of copper coating
