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离子液体中脉冲电镀铝 被引量:11

Pulse Aluminum Electroplating on Cu Substrate in Ionic Liquid Medium
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摘要 为了提高离子液体体系中镀铝层的致密性、均匀性和金属光泽度,配制了尿素-NaBr-KBr-甲酰胺-AlCl3低温离子液体,在铜基体上电镀铝。采用SEM、XRD等手段对镀铝层的形貌及晶型结构进行表征,考察了电流密度、电镀时间、温度及供电形式等对电镀铝的影响。结果表明:尿素-NaBr-KBr-甲酰胺-AlCl3离子液体的电导率随温度的升高而升高;脉冲电镀铝层性能优于直流电镀铝层;在电流密度50 mA/cm2,温度70℃,时间45 min条件下,利用数控脉冲电镀电源(ton=2 ms,toff=8 ms)在该离子液体中进行脉冲电镀,所得镀铝层结合力较好且镀层光亮、致密均匀、电结晶较好、纯度高,单质铝优先沿(200)晶面生长。 Low temperature ionic liquid NH2CONH2-NaBr-KBr-CH3NO-AlCl3 was prepared and used as a medium for pulse Al electroplating on Cu substrate so as to improve the compactness,uniformity and metallic luster of pulse electroplated Al coating.The morphology and crystal structure of as-plated Al coating were analyzed by scanning electron microscopy and X-ray diffraction,and the effects of current density,time,temperature and power-supplying mode on the performance of as-plated Al coating were investigated.Results showed that the electric conductivity of as-prepared NH2CONH2-NaBr-KBr-CH3NO-AlCl3 ionic liquid rose with increasing temperature,and pulse electroplated Al coating had better performance than direct current electroplated counterpart.Particularly,a bright,compact and uniform Al coating with high crystallinity and purity could be obtained on Cu substrate by pulse electroplating in the ionic liquid medium with a digital pulse plating power supply(ton = 2 ms,toff =8 ms) operating at a current density of 50 mA/cm2,a temperature of 70 ℃ and a duration of 45 min.Besides,metallic Al preferentially grew along(200) plane.
出处 《材料保护》 CAS CSCD 北大核心 2013年第1期31-34,8-9,共4页 Materials Protection
关键词 脉冲电镀 离子液体 ALCL3 电镀铝 形貌 晶型结构 pulse electroplating ionic liquid AlCl3 Al electroplating morphology crystal structure Cu substrate
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