摘要
针对焊接中去膜、润湿等助焊剂作用过程,简述了助焊剂的焊接理论,并对助焊剂中活性物质、溶剂、表面活性剂及成膜剂等主要组分在焊接过程中的作用机理及配方的设计思路进行归纳分析。根据当前研究热点,对复配与微胶囊化技术也作了综述,以期为新型助焊剂的研发提供理论参考。
The fundamental theory of fluxes for soldering is concisely reviewed with respect to the removal of oxidation film as well as the wetting process,etc. The roles of active components, solvents, surfactants, and film forming emulsifiers in fluxes are analyzed and summarized. In addition, the compounding technology and microencapsulation are discussed and prospected to highlight the future development. The above provides useful information for the design of new types of fluxes with improved properties.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2013年第2期66-69,83,共5页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.50804055)
湖南省自然科学基金资助项目(No.09JJ3100)
关键词
助焊剂
焊接
综述
机理
润湿
flux
soldering
review
mechanism
wetting
