摘要
用扫描电镜观察了直接镀钯铜线和电镀钯铜线的表面形貌,并对直接镀钯铜线的性能进行了研究。结果表明,直接镀钯技术优于电镀钯技术。直接镀钯铜线具有高的伸长率和破断力、好的表面质量、致密的镀层、高的电信号传输性能。
The morphology of the surface of direct Pd-coated copper wire （Direct PCC） and Pd-plated copper wire was observed by SEM, and the performance of Direct PCC was researched. The results show that the technology of Direct PCC is better tnan the technology of Pd-plated copper wire. The technology of Direct PCC has many advantages, such as high elongation and breaking load, good surface quality, dense coating, high electric signal transmission performance.
出处
《铸造技术》
CAS
北大核心
2013年第2期142-145,共4页
Foundry Technology
基金
甘肃省科技攻关项目(2GSO64-A52-05)
关键词
微电子封装
直接镀钯技术
直接镀钯铜线
制作工艺
性能
microelectronics packaging
Direct PCC process
Direct PCC wire
production process
performance
