摘要
对500℃左右的低温固体渗硼的可行性进行了动力学分析。探讨了渗硼介质的化学反应、反应气体的外部扩散、界面反应和硼原子向工件内部扩散四个分过程,为研制低温固体渗硼剂提供理论依据。
Engineering feasibility of low temperature pack boronizing at about 500 ℃ was analyzed in the view of kinetics. The chemical reaction of boronizing agents, external diffusion of gases produced by reaction, interface reaction and diffusion of boron atoms into workpiece were probed into with the aim of providing theoretic basis for development of low temperature pack boronizing agents.
出处
《热处理》
CAS
2013年第1期14-17,共4页
Heat Treatment
关键词
低温固体渗硼
动力学
扩散
low temperature pack boronizing
kinetic
diffusion
