摘要
通过分析压力传感器和FBG传感器的结构,针对金属磁记忆传感器自身特点,结合井下作业要求,提出了金属磁记忆传感器的封装设计原则;根据该原则,设计出了一种金属磁记忆传感器的封装结构,并对其进行了有限元模拟分析;对封装后的金属磁记忆传感器实物进行了室内压力试验研究,确定了该设计的可靠性。
After analyzing the packaging structures of the Pressure Sensor and Fiber Bragg Grating（FBG） Senor, this paper summarized the principle of packaging and designing for the Metal Magnetic Memory（MMM） Sensor. Under the guidance of the principle, the author designed a new packing structure for MMM senor, and then the structure was simulated in the Solidworks successfully. The packaging structure passed through two rounds pressure testing, which proved the stability of the design structure.
出处
《无损检测》
2013年第1期56-60,共5页
Nondestructive Testing
基金
国家科技支撑计划资助项目(2008BAB37B04)
关键词
金属磁记忆
传感器
封装
压力试验
Metal magnetic memory
Sensor
Packaging process
Pressure test
